拓鼎電子科技有限公司(ExTripod Electronics Technology Limited)成立于2011年,是一家專(zhuān)注于提供全球先進(jìn)的半導(dǎo)體封裝設(shè)備和材料的集成解決方案供應(yīng)商。中國(guó)運(yùn)營(yíng)總部設(shè)立于全國(guó)最大的納米技術(shù)應(yīng)用綜合社區(qū)-蘇州工業(yè)園區(qū)納米城,并在深圳,重慶,西安設(shè)立分支機(jī)構(gòu)。
ExTripod Electronics Technology Limited was founded in the year 2011 and focus on providing Integrated Solution with worldwide advanced equipment and material for Semiconductor Packaging. China Operation Headquarter is located in Suzhou Industrial Park Nano Centre, and wither branch office located in Shenzhen, Chongqing, and Xi'an.
公司以“為中國(guó)市場(chǎng)的客戶(hù)提供滿(mǎn)意的綜合性解決方案”為使命,始終專(zhuān)注于先進(jìn)封裝,功率半導(dǎo)體,和光電半導(dǎo)體。為OSAT,IDM, Fabless等客戶(hù)提供系統(tǒng)集成,機(jī)器定制,工藝和應(yīng)用支持。 公司技術(shù)即服務(wù)實(shí)力雄厚,主要成員具備專(zhuān)業(yè)的技術(shù)背景,豐富的行業(yè)經(jīng)驗(yàn)以及較高的業(yè)內(nèi)人員認(rèn)可和知名度。
Company's mission is " To Provide Integrated Solution for China Market", and keep on focus on marketing include Advanced Packaging, Power Semicon and Opto/LED. We provide system integration, automation, digitalization process & application support to customer include OSAT, IDM and Fabless and Institute. All the key members have strong technical background with wide experience, and high acknowledged by the industry.
拓鼎電子科技秉承“卓越,集成,專(zhuān)業(yè)”的企業(yè)理念, 始終與客戶(hù)和合作伙伴站在一起,贏(yíng)取市場(chǎng)并且真誠(chéng)立足于市場(chǎng)。
ExTripod Electronics Technology philosophy is "Excellence, Integration, Professional " we always stand together with customer and business partner, win the market and take hold in the market.
業(yè)務(wù)范圍
先進(jìn)封裝
先進(jìn)封裝作為半導(dǎo)體封裝技術(shù)的變革者,通過(guò)各種封裝技術(shù),包含Wire Bonder, Flip Chip Bonder, TC?bonder, Bumping, RDL等技術(shù),實(shí)現(xiàn)各種芯片異質(zhì)構(gòu)成和互聯(lián),以...
功率半導(dǎo)體
功率半導(dǎo)體封裝:通過(guò)各種鋁線(xiàn)/銅線(xiàn)的互聯(lián),焊片/納米銀材料的互聯(lián),以及焊接和燒結(jié)等工藝,將功率半導(dǎo)體實(shí)現(xiàn)最優(yōu)質(zhì)的散熱,導(dǎo)電性以及高可靠性的封裝。其性能好壞非...
光通信/射頻模塊介紹
光通信和射頻模塊作為萬(wàn)物互聯(lián)等必要手段,其在數(shù)據(jù)以及信號(hào)傳輸當(dāng)中決定我們是否真正走入數(shù)字化世界。
自動(dòng)化,集成化,數(shù)字化工廠(chǎng)介紹
自動(dòng)化,集成化,數(shù)字化將制造營(yíng)運(yùn)數(shù)據(jù)管理解決方案與企業(yè)信息整合,協(xié)助客戶(hù)改善整體質(zhì)量、成本、效率,打造高度自動(dòng)化的智能工廠(chǎng),達(dá)成精益生產(chǎn)的目標(biāo)。
服務(wù)承諾
EET將參展CSPT 2021, 并展示EET針對(duì)先進(jìn)封裝半導(dǎo)體的設(shè)備與材料.
2022-02-21拓鼎電子科技有限公司受邀參加PSIC2022中國(guó)國(guó)際新能源汽車(chē)功率半導(dǎo)體市場(chǎng)與關(guān)鍵技術(shù)論壇.
2022-07-19簽約韓國(guó)CNI Sputtering供應(yīng)商,共同開(kāi)發(fā)中國(guó)市場(chǎng) Sputtering技術(shù)作為射頻模塊當(dāng)中的EMI最為認(rèn)可的技術(shù),已經(jīng)廣發(fā)應(yīng)用于各種射頻....
2023-12-19